UNIVERSITY OF SCIENCES, HUE UNIVERSITY

Welcoming the delegates of the project on sending Information Technology students to Japan for their internship and graduation thesis.

On July 9, Assoc. Prof. Hoang Van Hien, Rector of Hue University of Sciences (HUSC) welcomed the delegates of the project on sending Information Technology students to Japan for their internship and graduation thesis.

The participants in the meeting included Dr. Le Van Tuong Lan, Vice Dean of the Faculty of Information Technology, Mr. Thai Nhat Truong, Vice Head of the Office for Student Affairs and Dr. Phan Tuan Anh, Vice Head of the Office for Science – Technology and International Relations, Prof. Kondo Hidemasa, Emeritus Professor of National University of Mongolia, Head of Legal Office of KIS Vietnam, Mr. Satou Junichi, company’ representative participating in the project and Mr. Nguyen Van Manh, Head of International Business Office, Assistant Manager of KIS-GE project together with other members of Grande – Etoile company

The project on sending students to Japan was implemented by Hue University of Sciences and Grande – Etoile company. From April to May 2019, Hue University of Sciences and Grande – Etoile company signed the MOU and the contract for project implementation. Accordingly, both sides have prepared some contents and facilities to conduct the project. In the coming time, the Office for Student Affairs and the Faculty of Information Technology will introduce about the project and instruct students for the registration.

The Rector Assoc. Prof. Hoang Van Hien stated the potentials of cooperation and affirmed the training quality as well as students’ qualifications. Prof. Kondo Hidemasa believed that Grande – Etoile company was the pioneer company calling for enterprises investing in Hue City in general and Hue University of Sciences in particular. The details on enrolment and teaching agenda by Prof. Kondo Hidemasa were discussed. Both sides will study to broaden the cooperative possibilities for other fields such as electronics and telecommunications, physics and architecture.

 

 

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